Quality Control

Quality Inspection Process

1\Packaging label verification: Compare with historical shipment records, {according to the manufacturer's label specifications, font, layout format, and corresponding rules of origin}; ESD consistency inspection, MSL inspection and verification, and other incoming packaging inspections;

2\Appearance verification of chip body: Verify the grinding body, pins, and solder balls of the chip through a microscope, use tools to measure whether the size and weight of the chip meet the original factory specifications, and combine information to check whether the screen printing of the chip body complies with the original factory naming rules. Finally, use instruments to test for any traces of processing and use;

3\Failure analysis verification: Use an X-ray non-destructive device perspective to verify whether the chip's wafer is consistent with the historical wafer circuit diagram;
Based on actual needs, we also have the following testing projects: key function testing, AC parameter testing and analysis, high/low temperature life aging testing, weldability/solderability testing, ultrasonic scanning, Rohs detection, and voids;

4\Professional testing equipment;

5\Authorized third-party test report.