Evaluation, Development Board Enclosures

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus ContainerType Platform Size/Dimension Height Area(LxW) Design Material Color Thickness Features
ASBC2RPI4 AppliedSBC Systems Evaluation, Development Board Enclosures

ASBC2RPI4

HEATSINK ENCLOSURE FOR RASPBERRY

AppliedSBC Systems
2,007 -

RFQ

FudongIC

Datasheet

Retail Package - Active Case Raspberry Pi 4 3.456 L x 2.315 W (87.80mm x 58.80mm) 0.640 (16.23mm) - Hand Held, Split Sides Metal, Aluminum Matte Black - Mounting Screws, Rubber Grip Pad
ASBC1RPI4 AppliedSBC Systems Evaluation, Development Board Enclosures

ASBC1RPI4

HEATSINK ENCLOSURE FOR RASPBERRY

AppliedSBC Systems
3,089 -

RFQ

FudongIC

Datasheet

Retail Package - Active Case Raspberry Pi 4 3.456 L x 2.315 W (87.80mm x 58.80mm) 0.640 (16.23mm) - Hand Held, Split Sides Metal, Aluminum Brushed Nickel - Mounting Screws, Rubber Grip Pad
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