Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
400-040-050 3M Sockets for ICs, Transistors

400-040-050

CONN IC DIP SOCKET 40POS GOLD

3M
3,057 -

RFQ

FudongIC

Datasheet

Box 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
500-032-050 3M Sockets for ICs, Transistors

500-032-050

CONN SOCKET SIP 32POS GOLD

3M
2,352 -

RFQ

FudongIC

Datasheet

Box - Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
2100-6310-9UA-1902 3M Sockets for ICs, Transistors

2100-6310-9UA-1902

10X10 GRID ZIP SOCKET

3M
2,590 -

RFQ

Bulk - Obsolete - 100 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
249-930X-XX-2401 3M Sockets for ICs, Transistors

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

3M
2,532 -

RFQ

- Textool™ Obsolete BGA 49 (Verification Required) 0.039 (1.00mm) Gold - - Through Hole Closed Frame - - - - - -
4842-6004-CP 3M Sockets for ICs, Transistors

4842-6004-CP

CONN IC DIP SOCKET 42POS TIN

3M
2,405 -

RFQ

Bulk 4800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled
232-1270-01-0602 3M Sockets for ICs, Transistors

232-1270-01-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M
3,459 -

RFQ

FudongIC

Datasheet

Bulk Textool™ Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
232-1270-02-0602 3M Sockets for ICs, Transistors

232-1270-02-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M
3,986 -

RFQ

FudongIC

Datasheet

Bulk Textool™ Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
239-5605-02-0602 3M Sockets for ICs, Transistors

239-5605-02-0602

CONN ZIG-ZAG 39POS GOLD

3M
3,552 -

RFQ

FudongIC

Datasheet

Bulk - Active Zig-Zag 39 (1 x 19, 1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
CUSTOM BGA 3M Sockets for ICs, Transistors

CUSTOM BGA

CONN SOCKET BGA CUSTOM

3M
3,033 -

RFQ

FudongIC

Datasheet

- Textool™ Active BGA Custom 0.026 ~ 0.050 (0.65mm ~ 1.27mm) Custom Custom - Through Hole Custom - - - - - -
232-1270-51-0602 3M Sockets for ICs, Transistors

232-1270-51-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M
2,597 -

RFQ

- Textool™ Active - - - - - - - - - - - - - -
232-1270-52-0602 3M Sockets for ICs, Transistors

232-1270-52-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M
2,012 -

RFQ

- Textool™ Active - - - - - - - - - - - - - -
232-1271-00-1102JH 3M Sockets for ICs, Transistors

232-1271-00-1102JH

OEM LCC SOCKETS 32 POS SOLID LID

3M
2,267 -

RFQ

FudongIC

Datasheet

- OEM Obsolete - - - - - - - - - - - - - -
234-3034-51-0602 3M Sockets for ICs, Transistors

234-3034-51-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M
3,300 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
234-3034-52-0602 3M Sockets for ICs, Transistors

234-3034-52-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M
3,697 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-51-0602 3M Sockets for ICs, Transistors

235-3019-51-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M
2,586 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-52-0602 3M Sockets for ICs, Transistors

235-3019-52-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M
3,841 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
236-6225-50-0602 3M Sockets for ICs, Transistors

236-6225-50-0602

SOCKET ZIP IN-LINE 36POS

3M
3,445 -

RFQ

Box - Active - - - - - - - - - - - - - -
239-5605-51-0602 3M Sockets for ICs, Transistors

239-5605-51-0602

CONN SOCKET 39POS ZIP STRIP

3M
3,702 -

RFQ

- - Active - - - - - - - - - - - - - -
239-5605-52-0602 3M Sockets for ICs, Transistors

239-5605-52-0602

CONN SOCKET 39POS ZIP STRIP

3M
2,175 -

RFQ

- - Active - - - - - - - - - - - - - -
251-5949-51-0602 3M Sockets for ICs, Transistors

251-5949-51-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M
3,771 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
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