Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
558-10-292M20-001104 Preci-Dip Sockets for ICs, Transistors

558-10-292M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
2,017 -

RFQ

FudongIC

Datasheet

Bulk 558 Active BGA 292 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-87-447-20-121147 Preci-Dip Sockets for ICs, Transistors

546-87-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip
3,490 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 447 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-292M20-001105 Preci-Dip Sockets for ICs, Transistors

518-77-292M20-001105

CONN SOCKET PGA 292POS GOLD

Preci-Dip
2,586 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
546-83-364-17-091147 Preci-Dip Sockets for ICs, Transistors

546-83-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip
3,301 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 364 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-365-14-000147 Preci-Dip Sockets for ICs, Transistors

546-83-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
2,577 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 365 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-365-17-091147 Preci-Dip Sockets for ICs, Transistors

546-83-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
2,216 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 365 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-420M26-001148 Preci-Dip Sockets for ICs, Transistors

514-87-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip
3,435 -

RFQ

FudongIC

Datasheet

Bulk 514 Active BGA 420 (26 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-478M26-131166 Preci-Dip Sockets for ICs, Transistors

550-10-478M26-131166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,410 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-480M29-001166 Preci-Dip Sockets for ICs, Transistors

550-10-480M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,829 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-599-54-131111 Preci-Dip Sockets for ICs, Transistors

517-83-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip
2,914 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-292M20-001106 Preci-Dip Sockets for ICs, Transistors

518-77-292M20-001106

CONN SOCKET PGA 292POS GOLD

Preci-Dip
2,491 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
614-83-279-19-081112 Preci-Dip Sockets for ICs, Transistors

614-83-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip
3,377 -

RFQ

FudongIC

Datasheet

Bulk 614 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-357M19-001148 Preci-Dip Sockets for ICs, Transistors

514-83-357M19-001148

CONN SOCKET BGA 357POS GOLD

Preci-Dip
2,883 -

RFQ

FudongIC

Datasheet

Bulk 514 Active BGA 357 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-320-19-131144 Preci-Dip Sockets for ICs, Transistors

614-87-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip
2,252 -

RFQ

FudongIC

Datasheet

Bulk 614 Active PGA 320 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-321-19-121144 Preci-Dip Sockets for ICs, Transistors

614-87-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip
2,824 -

RFQ

FudongIC

Datasheet

Bulk 614 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-356M26-001152 Preci-Dip Sockets for ICs, Transistors

550-10-356M26-001152

BGA SOLDER TAIL

Preci-Dip
3,362 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
614-83-281-19-001112 Preci-Dip Sockets for ICs, Transistors

614-83-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip
2,582 -

RFQ

FudongIC

Datasheet

Bulk 614 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-463-19-101147 Preci-Dip Sockets for ICs, Transistors

546-87-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip
2,009 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 463 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-432M31-001148 Preci-Dip Sockets for ICs, Transistors

514-87-432M31-001148

CONN SOCKET BGA 432POS GOLD

Preci-Dip
2,452 -

RFQ

FudongIC

Datasheet

Bulk 514 Active BGA 432 (31 x 31) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-299-20-001112 Preci-Dip Sockets for ICs, Transistors

614-83-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip
2,080 -

RFQ

FudongIC

Datasheet

Bulk 614 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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