Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-424-31-012101 Preci-Dip Sockets for ICs, Transistors

614-87-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,607 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-032-09-041101 Preci-Dip Sockets for ICs, Transistors

510-83-032-09-041101

CONN SOCKET PGA 32POS GOLD

Preci-Dip
2,629 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 32 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-105161 Preci-Dip Sockets for ICs, Transistors

110-83-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,075 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-312-41-002101 Preci-Dip Sockets for ICs, Transistors

124-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,490 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-009101 Preci-Dip Sockets for ICs, Transistors

116-83-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,225 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-013101 Preci-Dip Sockets for ICs, Transistors

116-87-308-41-013101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,654 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-420-41-001101 Preci-Dip Sockets for ICs, Transistors

612-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,008 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-422-41-001101 Preci-Dip Sockets for ICs, Transistors

614-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,257 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-006101 Preci-Dip Sockets for ICs, Transistors

116-83-320-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,535 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-11-001101 Preci-Dip Sockets for ICs, Transistors

299-83-308-11-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,891 -

RFQ

FudongIC

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-324-41-134191 Preci-Dip Sockets for ICs, Transistors

114-87-324-41-134191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,838 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-428-41-001101 Preci-Dip Sockets for ICs, Transistors

110-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,191 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-001101 Preci-Dip Sockets for ICs, Transistors

110-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,439 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-001151 Preci-Dip Sockets for ICs, Transistors

110-83-628-41-001151

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,625 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-320-41-001101 Preci-Dip Sockets for ICs, Transistors

612-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,806 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-008101 Preci-Dip Sockets for ICs, Transistors

116-83-314-41-008101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,154 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-41-105101 Preci-Dip Sockets for ICs, Transistors

110-87-328-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,352 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-628-41-001101 Preci-Dip Sockets for ICs, Transistors

614-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,300 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-428-41-001101 Preci-Dip Sockets for ICs, Transistors

614-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,444 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-003101 Preci-Dip Sockets for ICs, Transistors

116-87-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,318 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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