Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
122-87-322-41-001101 Preci-Dip Sockets for ICs, Transistors

122-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,593 -

RFQ

FudongIC

Datasheet

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-422-41-001101 Preci-Dip Sockets for ICs, Transistors

122-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,032 -

RFQ

FudongIC

Datasheet

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-322-41-001101 Preci-Dip Sockets for ICs, Transistors

123-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,380 -

RFQ

FudongIC

Datasheet

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-422-41-001101 Preci-Dip Sockets for ICs, Transistors

123-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,805 -

RFQ

FudongIC

Datasheet

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-002101 Preci-Dip Sockets for ICs, Transistors

116-87-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,884 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-324-41-001101 Preci-Dip Sockets for ICs, Transistors

612-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,004 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-004101 Preci-Dip Sockets for ICs, Transistors

116-87-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,368 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-41-105191 Preci-Dip Sockets for ICs, Transistors

110-83-312-41-105191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,428 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-001101 Preci-Dip Sockets for ICs, Transistors

116-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,027 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-608-10-002101 Preci-Dip Sockets for ICs, Transistors

299-87-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,349 -

RFQ

FudongIC

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-001101 Preci-Dip Sockets for ICs, Transistors

115-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,663 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-003101 Preci-Dip Sockets for ICs, Transistors

116-87-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,269 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-003101 Preci-Dip Sockets for ICs, Transistors

115-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,357 -

RFQ

FudongIC

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-428-41-003101 Preci-Dip Sockets for ICs, Transistors

115-83-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,979 -

RFQ

FudongIC

Datasheet

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-009101 Preci-Dip Sockets for ICs, Transistors

116-87-320-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,824 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-009101 Preci-Dip Sockets for ICs, Transistors

116-87-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,183 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-620-41-105101 Preci-Dip Sockets for ICs, Transistors

117-83-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,442 -

RFQ

FudongIC

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-624-41-001101 Preci-Dip Sockets for ICs, Transistors

614-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,662 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-422-41-001101 Preci-Dip Sockets for ICs, Transistors

612-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,983 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-018101 Preci-Dip Sockets for ICs, Transistors

116-87-428-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,705 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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