Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
122-83-424-41-001101 Preci-Dip Sockets for ICs, Transistors

122-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,383 -

RFQ

FudongIC

Datasheet

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-424-41-001101 Preci-Dip Sockets for ICs, Transistors

123-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,465 -

RFQ

FudongIC

Datasheet

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-640-41-001101 Preci-Dip Sockets for ICs, Transistors

614-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,175 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-001101 Preci-Dip Sockets for ICs, Transistors

116-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,207 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-002101 Preci-Dip Sockets for ICs, Transistors

116-83-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,672 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-428-41-001101 Preci-Dip Sockets for ICs, Transistors

612-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,442 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-428-41-105101 Preci-Dip Sockets for ICs, Transistors

117-83-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,195 -

RFQ

FudongIC

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-009101 Preci-Dip Sockets for ICs, Transistors

116-83-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,648 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-642-41-005101 Preci-Dip Sockets for ICs, Transistors

117-83-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,655 -

RFQ

FudongIC

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-636-41-001101 Preci-Dip Sockets for ICs, Transistors

115-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,315 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-424-41-035101 Preci-Dip Sockets for ICs, Transistors

146-83-424-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,133 -

RFQ

FudongIC

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-424-41-036101 Preci-Dip Sockets for ICs, Transistors

146-83-424-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,722 -

RFQ

FudongIC

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-001101 Preci-Dip Sockets for ICs, Transistors

116-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,210 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-001101 Preci-Dip Sockets for ICs, Transistors

116-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,885 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-650-41-003101 Preci-Dip Sockets for ICs, Transistors

115-87-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,794 -

RFQ

FudongIC

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-008101 Preci-Dip Sockets for ICs, Transistors

116-87-328-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,313 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-632-41-001101 Preci-Dip Sockets for ICs, Transistors

614-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,049 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-018101 Preci-Dip Sockets for ICs, Transistors

116-87-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,026 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-424-41-001101 Preci-Dip Sockets for ICs, Transistors

121-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,985 -

RFQ

FudongIC

Datasheet

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-624-41-001101 Preci-Dip Sockets for ICs, Transistors

121-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,848 -

RFQ

FudongIC

Datasheet

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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