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Sockets for ICs, Transistors

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
40-6554-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	360	-	RFQ	Datasheet	Tube	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
24-6554-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	183	-	RFQ	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6554-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	320	-	RFQ	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6554-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	342	-	RFQ	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
32-6554-11 CONN IC DIP SOCKET ZIF 32POS GLD Aries Electronics	103	-	RFQ	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
0804MC CONN TRANSIST TO-3 8POS GOLD Texas Instruments	245	-	RFQ		Tray	-	Active	Transistor, TO-3	8 (Oval)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyester, Glass Filled
24-6554-16 CONN IC DIP SOCKET ZIF 24POS Aries Electronics	209	-	RFQ	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
232-5205-01 CONN SOCKET QFN 32POS GOLD 3M	2,291	-	RFQ	Datasheet	Bulk	Textool™	Active	QFN	32 (4 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
240-5205-01 CONN SOCKET QFN 40POS GOLD 3M	3,088	-	RFQ	Datasheet	Bulk	Textool™	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
2-2822979-3 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	147	-	RFQ	Datasheet	Tray	-	Active	LGA	3647	0.039 (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic
210-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,576	-	RFQ	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ED020PLCZ CONN SOCKET PLCC 20POS TIN On Shore Technology Inc.	2,420	-	RFQ	Datasheet	Tube	ED	Active	PLCC	20 (4 x 5)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
4832-6004-CP CONN IC DIP SOCKET 32POS TIN 3M	1,424	-	RFQ	Datasheet	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
AR 06-HZL/07-TT CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	5,609	-	RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
8432-21A1-RK-TP CONN SOCKET PLCC 32POS TIN 3M	1,052	-	RFQ	Datasheet	Tube	8400	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS 028-G-T CONN SOCKET PLCC 28POS GOLD Assmann WSW Components	875	-	RFQ	Datasheet	Tube	-	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
114-87-318-41-134161 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	1,047	-	RFQ	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 24-HZL/01/7-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	1,434	-	RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
69802-044LF CONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI)	5,333	-	RFQ	Datasheet	Tube	-	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)
D2822-42 CONN IC DIP SOCKET 22POS GOLD Harwin Inc.	1,083	-	RFQ	Datasheet	Tube	D2	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic