Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-081-12-071101 Preci-Dip Sockets for ICs, Transistors

510-83-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip
2,689 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-952-41-001101 Preci-Dip Sockets for ICs, Transistors

612-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,759 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-14-071101 Preci-Dip Sockets for ICs, Transistors

510-87-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,730 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-013101 Preci-Dip Sockets for ICs, Transistors

116-83-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,374 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-004101 Preci-Dip Sockets for ICs, Transistors

116-83-328-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,678 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-004101 Preci-Dip Sockets for ICs, Transistors

116-83-428-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,268 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-964-31-012101 Preci-Dip Sockets for ICs, Transistors

614-87-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,307 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-11-001101 Preci-Dip Sockets for ICs, Transistors

510-83-100-11-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,732 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 100 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-43-314-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,739 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-308-G-A Samtec Inc. Sockets for ICs, Transistors

APA-308-G-A

ADAPTER PLUG

Samtec Inc.
2,500 -

RFQ

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-320-T-A1 Samtec Inc. Sockets for ICs, Transistors

APA-320-T-A1

ADAPTER PLUG

Samtec Inc.
3,280 -

RFQ

Bulk APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-155-16-003101 Preci-Dip Sockets for ICs, Transistors

510-87-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip
2,902 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-155-16-093101 Preci-Dip Sockets for ICs, Transistors

510-87-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip
2,669 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-105191 Preci-Dip Sockets for ICs, Transistors

110-83-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,637 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-122-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-93-122-41-013000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.
3,180 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-122-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-122-41-013000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.
3,991 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-640-41-801101 Preci-Dip Sockets for ICs, Transistors

110-83-640-41-801101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,412 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-018101 Preci-Dip Sockets for ICs, Transistors

116-83-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,087 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-428-41-002101 Preci-Dip Sockets for ICs, Transistors

124-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,199 -

RFQ

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-628-41-002101 Preci-Dip Sockets for ICs, Transistors

124-83-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,736 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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