Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
104-11-308-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-308-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,299 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,820 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-316-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
3,203 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-210-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,554 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-210-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,160 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-0508-20 Aries Electronics Sockets for ICs, Transistors

28-0508-20

CONN SOCKET SIP 28POS GOLD

Aries Electronics
2,141 -

RFQ

FudongIC

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-0508-30 Aries Electronics Sockets for ICs, Transistors

28-0508-30

CONN SOCKET SIP 28POS GOLD

Aries Electronics
2,225 -

RFQ

FudongIC

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-20 Aries Electronics Sockets for ICs, Transistors

28-1508-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,702 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-30 Aries Electronics Sockets for ICs, Transistors

28-1508-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,836 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-PGM06002-10 Aries Electronics Sockets for ICs, Transistors

28-PGM06002-10

CONN SOCKET PGA GOLD

Aries Electronics
2,071 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-91-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,849 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,032 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,615 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,975 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-210-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,033 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-210-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,238 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-310-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,093 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-310-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,749 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-318-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-44-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,466 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-308-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,085 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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