Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-308-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,642 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-308-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,244 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-428-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-428-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,295 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-243-19-081101 Preci-Dip Sockets for ICs, Transistors

510-83-243-19-081101

CONN SOCKET PGA 243POS GOLD

Preci-Dip
3,740 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 243 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-306-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
2,818 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-316-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,867 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-316-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,884 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-314-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-93-314-41-013000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
2,817 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-314-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-43-314-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,435 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-306-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,723 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-306-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,310 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6513-11H Aries Electronics Sockets for ICs, Transistors

40-6513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,380 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
210-99-632-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-99-632-41-001000

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.
2,970 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-306-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,710 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-642-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-642-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,640 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-47-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,069 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-47-420-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,426 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-316-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-41-316-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,922 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-316-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-91-316-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,332 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-120-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-47-120-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
2,892 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 20 (1 x 20) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 328329330331332333334335...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • FudongIC
    1500+ Daily average RFQ Volume
    FudongIC
    20,000.000 Standard Product Unit
    FudongIC
    1800+ Worldwide Manufacturers
    FudongIC
    15,000+ In-stock Warehouse
    FudongIC

    HOME

    FudongIC

    PRODUCT

    FudongIC

    PHONE

    FudongIC

    USER