Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
210-11-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-11-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,343 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-114-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-47-114-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
2,973 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 14 (1 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-7350-10 Aries Electronics Sockets for ICs, Transistors

14-7350-10

CONN SOCKET SIP 14POS TIN

Aries Electronics
3,836 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-7380-10 Aries Electronics Sockets for ICs, Transistors

14-7380-10

CONN SOCKET SIP 14POS TIN

Aries Electronics
2,260 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-7470-10 Aries Electronics Sockets for ICs, Transistors

14-7470-10

CONN SOCKET SIP 14POS TIN

Aries Electronics
3,791 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-7500-10 Aries Electronics Sockets for ICs, Transistors

14-7500-10

CONN SOCKET SIP 14POS TIN

Aries Electronics
2,178 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-7750-10 Aries Electronics Sockets for ICs, Transistors

14-7750-10

CONN SOCKET SIP 14POS TIN

Aries Electronics
3,517 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-820-90C Aries Electronics Sockets for ICs, Transistors

24-820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,049 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-822-90C Aries Electronics Sockets for ICs, Transistors

24-822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,695 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-823-90C Aries Electronics Sockets for ICs, Transistors

24-823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,329 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
317-91-110-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-91-110-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
3,560 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 10 (1 x 10) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,814 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-43-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,390 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-108-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

917-41-108-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.
2,508 -

RFQ

FudongIC

Datasheet

Tube 917 Active Transistor, TO-5 8 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-208-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

917-41-208-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.
2,371 -

RFQ

FudongIC

Datasheet

Tube 917 Active Transistor, TO-100 8 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-91-108-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

917-91-108-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.
2,329 -

RFQ

FudongIC

Datasheet

Tube 917 Active Transistor, TO-5 8 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-91-208-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

917-91-208-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.
2,532 -

RFQ

FudongIC

Datasheet

Tube 917 Active Transistor, TO-100 8 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-632-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-44-632-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,675 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-632-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-47-632-41-003000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,777 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8080-1G31 TE Connectivity AMP Connectors Sockets for ICs, Transistors

8080-1G31

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors
2,860 -

RFQ

FudongIC

Datasheet

Bulk 8060 Active Transistor, TO-3 3 (Oval) - Tin - Beryllium Copper Chassis Mount Closed Frame Solder - Tin - Beryllium Copper Polytetrafluoroethylene (PTFE)
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