Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-0501-31 Aries Electronics Sockets for ICs, Transistors

14-0501-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics
2,492 -

RFQ

FudongIC

Datasheet

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-01 Aries Electronics Sockets for ICs, Transistors

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,861 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6820-90C Aries Electronics Sockets for ICs, Transistors

20-6820-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,832 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6822-90C Aries Electronics Sockets for ICs, Transistors

20-6822-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,574 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6823-90C Aries Electronics Sockets for ICs, Transistors

20-6823-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,375 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-308-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-13-308-41-001000

SOCKET CARRIER SLDRTL .300 8POS

Mill-Max Manufacturing Corp.
3,151 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-652-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-652-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,632 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-422-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-422-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,708 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-640-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-47-640-41-003000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,641 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-11-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,083 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-324-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-324-41-605000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,493 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-624-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-624-41-605000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,214 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-324-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-324-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,590 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-624-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-624-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,308 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-8865-310C Aries Electronics Sockets for ICs, Transistors

20-8865-310C

CONN ELEVATOR SOCKET 20 PO .300

Aries Electronics
3,771 -

RFQ

- 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
410-93-220-10-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

410-93-220-10-002000

SOCKET DUAL IN-LINE SLDRTL 20POS

Mill-Max Manufacturing Corp.
2,932 -

RFQ

FudongIC

Datasheet

Tube 410 Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-428-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-428-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,347 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-628-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-628-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,938 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-432-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-47-432-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,647 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-632-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-47-632-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,424 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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