Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-43-422-41-012000

146-43-422-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,488 -

RFQ

146-43-422-41-012000

Datasheet

Tube 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-650-41-001000

110-91-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,229 -

RFQ

110-91-650-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-650-41-001000

110-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,681 -

RFQ

110-41-650-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-422-41-105000

110-93-422-41-105000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,716 -

RFQ

110-93-422-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-322-41-105000

110-43-322-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,538 -

RFQ

110-43-322-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-422-41-105000

110-43-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,540 -

RFQ

110-43-422-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-308-41-003000

126-93-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,088 -

RFQ

126-93-308-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-308-41-003000

126-43-308-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,818 -

RFQ

126-43-308-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-316-31-007000

614-41-316-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,825 -

RFQ

614-41-316-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-316-31-007000

614-91-316-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,673 -

RFQ

614-91-316-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-432-41-117000

114-41-432-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,891 -

RFQ

114-41-432-41-117000

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-632-41-117000

114-41-632-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,436 -

RFQ

114-41-632-41-117000

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-432-41-117000

114-91-432-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,504 -

RFQ

114-91-432-41-117000

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-632-41-117000

114-91-632-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,215 -

RFQ

114-91-632-41-117000

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-3513-11H

26-3513-11H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,560 -

RFQ

26-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6621-30

12-6621-30

CONN IC DIP SOCKET 12POS TIN

Aries Electronics
3,157 -

RFQ

12-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
317-91-119-41-005000

317-91-119-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,106 -

RFQ

317-91-119-41-005000

Datasheet

Bulk 317 Active SIP 19 (1 x 19) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-120-41-013000

346-93-120-41-013000

SOCKET SLDRLSS PRESSFIT SIP20POS

Mill-Max Manufacturing Corp.
3,056 -

RFQ

346-93-120-41-013000

Datasheet

Tube 346 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-322-41-001000

110-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,963 -

RFQ

110-13-322-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-422-41-001000

110-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,649 -

RFQ

110-13-422-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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