Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
257-PGM20012-10 Aries Electronics Sockets for ICs, Transistors

257-PGM20012-10

CONN SOCKET PGA GOLD

Aries Electronics
2,581 -

RFQ

FudongIC

Datasheet

Bulk PGM Obsolete PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-14 Aries Electronics Sockets for ICs, Transistors

1109800-14

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,645 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-16 Aries Electronics Sockets for ICs, Transistors

1109800-16

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,485 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-18 Aries Electronics Sockets for ICs, Transistors

1109800-18

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,490 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-20 Aries Electronics Sockets for ICs, Transistors

1109800-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,993 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-28 Aries Electronics Sockets for ICs, Transistors

1109800-28

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,496 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-10 Aries Electronics Sockets for ICs, Transistors

1109800-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
3,502 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-12 Aries Electronics Sockets for ICs, Transistors

1109800-12

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
3,023 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-22 Aries Electronics Sockets for ICs, Transistors

1109800-22

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,606 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-24 Aries Electronics Sockets for ICs, Transistors

1109800-24

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,964 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-26 Aries Electronics Sockets for ICs, Transistors

1109800-26

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,002 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-8 Aries Electronics Sockets for ICs, Transistors

1109800-8

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,116 -

RFQ

FudongIC

Datasheet

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-308 Aries Electronics Sockets for ICs, Transistors

1109681-308

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,577 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-314 Aries Electronics Sockets for ICs, Transistors

1109681-314

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,534 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-316 Aries Electronics Sockets for ICs, Transistors

1109681-316

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,938 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-318 Aries Electronics Sockets for ICs, Transistors

1109681-318

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,089 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-320 Aries Electronics Sockets for ICs, Transistors

1109681-320

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,632 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-324 Aries Electronics Sockets for ICs, Transistors

1109681-324

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,893 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-328 Aries Electronics Sockets for ICs, Transistors

1109681-328

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,569 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-624 Aries Electronics Sockets for ICs, Transistors

1109681-624

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,168 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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