Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
104-13-316-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-13-316-41-770000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,629 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
614-41-318-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-318-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,383 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-318-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-318-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,030 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-432-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,999 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-120-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-93-120-31-012000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.
3,906 -

RFQ

FudongIC

Datasheet

Tube 714 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-432-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,533 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-328-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-328-41-117000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,946 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-428-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-428-41-117000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,133 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-628-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-628-41-117000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,824 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-328-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-328-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,723 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-428-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-428-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,141 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-628-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-628-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,536 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,257 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,679 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3572-10 Aries Electronics Sockets for ICs, Transistors

24-3572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,624 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3573-10 Aries Electronics Sockets for ICs, Transistors

24-3573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,081 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3574-10 Aries Electronics Sockets for ICs, Transistors

24-3574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,534 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3575-10 Aries Electronics Sockets for ICs, Transistors

24-3575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,427 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6571-10 Aries Electronics Sockets for ICs, Transistors

24-6571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,531 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
210-13-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-13-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,376 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 386387388389390391392393...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • FudongIC
    1500+ Daily average RFQ Volume
    FudongIC
    20,000.000 Standard Product Unit
    FudongIC
    1800+ Worldwide Manufacturers
    FudongIC
    15,000+ In-stock Warehouse
    FudongIC

    HOME

    FudongIC

    PRODUCT

    FudongIC

    PHONE

    FudongIC

    USER