Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
APA-624-G-M Samtec Inc. Sockets for ICs, Transistors

APA-624-G-M

ADAPTER PLUG

Samtec Inc.
3,538 -

RFQ

Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-316-G-Q Samtec Inc. Sockets for ICs, Transistors

APA-316-G-Q

ADAPTER PLUG

Samtec Inc.
2,423 -

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
605-41-318-11-480000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

605-41-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,500 -

RFQ

FudongIC

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-318-11-480000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

605-91-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,233 -

RFQ

FudongIC

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-320-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,662 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-420-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-420-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,614 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-320-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,082 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-420-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-420-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,567 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-422-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-422-41-605000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,591 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-422-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-422-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,254 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-133-14-002135 Preci-Dip Sockets for ICs, Transistors

546-83-133-14-002135

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,498 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-133-14-002136 Preci-Dip Sockets for ICs, Transistors

546-83-133-14-002136

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,729 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-91-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-318-41-001000

SOCKET IC OPEN 3 LVL .300 18POS

Mill-Max Manufacturing Corp.
3,150 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,561 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-13-120-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

315-13-120-41-001000

SOCKET LOW PROFILE SIP 20POS

Mill-Max Manufacturing Corp.
2,355 -

RFQ

Tube 315 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-322-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-322-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,093 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-422-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-422-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,399 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-6621-30 Aries Electronics Sockets for ICs, Transistors

14-6621-30

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,717 -

RFQ

FudongIC

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
115-41-648-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,386 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-648-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-648-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
3,781 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 391392393394395396397398...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • FudongIC
    1500+ Daily average RFQ Volume
    FudongIC
    20,000.000 Standard Product Unit
    FudongIC
    1800+ Worldwide Manufacturers
    FudongIC
    15,000+ In-stock Warehouse
    FudongIC

    HOME

    FudongIC

    PRODUCT

    FudongIC

    PHONE

    FudongIC

    USER