Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-8724-610C Aries Electronics Sockets for ICs, Transistors

20-8724-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,527 -

RFQ

FudongIC

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8950-610C Aries Electronics Sockets for ICs, Transistors

20-8950-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,930 -

RFQ

FudongIC

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
66-PGM11054-10 Aries Electronics Sockets for ICs, Transistors

66-PGM11054-10

CONN SOCKET PGA GOLD

Aries Electronics
3,071 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-93-432-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-432-31-007000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.
2,563 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-632-31-007000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.
3,603 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-432-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-432-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,324 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-632-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-632-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,812 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-636-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,086 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-636-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,997 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-642-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,725 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-642-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,633 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-640-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,993 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-640-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-640-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,063 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-322-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,336 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-422-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,494 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-322-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,459 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-422-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,813 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-316-G-B Samtec Inc. Sockets for ICs, Transistors

APA-316-G-B

ADAPTER PLUG

Samtec Inc.
2,687 -

RFQ

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
126-41-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,999 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,933 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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