Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
415-93-264-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

415-93-264-41-001000

SOCKET DUAL INLINE LOW PRO 64POS

Mill-Max Manufacturing Corp.
2,379 -

RFQ

FudongIC

Datasheet

Tube 415 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,665 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-432-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,190 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-632-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,953 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,195 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-642-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-642-41-003000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,118 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,003 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,663 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,306 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,541 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,787 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,311 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,195 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-636-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,040 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-636-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,614 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
64-9513-11 Aries Electronics Sockets for ICs, Transistors

64-9513-11

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,953 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9518-10H Aries Electronics Sockets for ICs, Transistors

64-9518-10H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,922 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0508-21 Aries Electronics Sockets for ICs, Transistors

19-0508-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics
3,753 -

RFQ

FudongIC

Datasheet

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
19-0508-31 Aries Electronics Sockets for ICs, Transistors

19-0508-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics
3,996 -

RFQ

FudongIC

Datasheet

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
104-11-640-41-780000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-640-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,722 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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