Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-632-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-632-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,387 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-432-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-432-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,401 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-632-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-632-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,841 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-640-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-640-31-007000

SOCKET CARRIER LOWPRO .600 40POS

Mill-Max Manufacturing Corp.
3,005 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-640-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-640-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,500 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-652-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,486 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-652-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,931 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-322-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,194 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-422-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,180 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-322-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,317 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-422-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,045 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-640-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-640-41-105000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,272 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-640-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,228 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-328-41-780000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-328-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,321 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-428-41-780000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-428-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,922 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-628-41-780000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-11-628-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,646 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-952-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,464 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-952-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,383 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3508-202 Aries Electronics Sockets for ICs, Transistors

28-3508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,521 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-302 Aries Electronics Sockets for ICs, Transistors

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,456 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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