Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
211-1-32-006 CNC Tech Sockets for ICs, Transistors

211-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech
992 -

RFQ

FudongIC

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
NTE435K42 NTE Electronics, Inc Sockets for ICs, Transistors

NTE435K42

SOCKET-42 PIN DIP .070

NTE Electronics, Inc
3,416 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) - - - - - - Solder 0.100 (2.54mm) - - - -
211-1-40-006 CNC Tech Sockets for ICs, Transistors

211-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech
954 -

RFQ

FudongIC

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
ICF-318-T-O Samtec Inc. Sockets for ICs, Transistors

ICF-318-T-O

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.
2,551 -

RFQ

FudongIC

Datasheet

Tube iCF Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICA-628-SGG Samtec Inc. Sockets for ICs, Transistors

ICA-628-SGG

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.
2,577 -

RFQ

FudongIC

Datasheet

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled
NTE436W24 NTE Electronics, Inc Sockets for ICs, Transistors

NTE436W24

24-PIN DIP IC SOCKET

NTE Electronics, Inc
2,583 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) - - - - Through Hole - Wire Wrap - - - - -
ICA-640-SGG Samtec Inc. Sockets for ICs, Transistors

ICA-640-SGG

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.
2,785 -

RFQ

FudongIC

Datasheet

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled
APA-316-G-P Samtec Inc. Sockets for ICs, Transistors

APA-316-G-P

ADAPTER PLUG

Samtec Inc.
3,655 -

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-T-B Samtec Inc. Sockets for ICs, Transistors

APA-640-T-B

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A1 Samtec Inc. Sockets for ICs, Transistors

APA-640-G-A1

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A Samtec Inc. Sockets for ICs, Transistors

APA-640-G-A

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-43-101-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.
313 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-101-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-101-31-018000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.
222 -

RFQ

FudongIC

Datasheet

Bulk 714 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-102-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-93-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.
7,674 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-102-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-102-41-013000

CONN SOCKET SIP 2POS GOLD

Mill-Max Manufacturing Corp.
1,302 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-204-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-204-31-018000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.
112 -

RFQ

FudongIC

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
BU14OZ-178-HT On Shore Technology Inc. Sockets for ICs, Transistors

BU14OZ-178-HT

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.
2,422 -

RFQ

FudongIC

Datasheet

Tube BU-178HT Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled
1571552-2 TE Connectivity AMP Connectors Sockets for ICs, Transistors

1571552-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
413 -

RFQ

FudongIC

Datasheet

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-316-10-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-316-10-004000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,767 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571586-2 TE Connectivity AMP Connectors Sockets for ICs, Transistors

1571586-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
909 -

RFQ

FudongIC

Datasheet

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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