Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
84-PGM10003-10 Aries Electronics Sockets for ICs, Transistors

84-PGM10003-10

CONN SOCKET PGA GOLD

Aries Electronics
2,153 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11009-10 Aries Electronics Sockets for ICs, Transistors

84-PGM11009-10

CONN SOCKET PGA GOLD

Aries Electronics
2,825 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11010-10 Aries Electronics Sockets for ICs, Transistors

84-PGM11010-10

CONN SOCKET PGA GOLD

Aries Electronics
3,667 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM13053-10 Aries Electronics Sockets for ICs, Transistors

84-PGM13053-10

CONN SOCKET PGA GOLD

Aries Electronics
3,858 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
126-41-318-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,291 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-318-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,880 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-656-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-47-656-41-005000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.
2,528 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
326-93-120-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

326-93-120-41-002000

SOCKET WRAP SOLDERTAIL SIP 20POS

Mill-Max Manufacturing Corp.
3,001 -

RFQ

FudongIC

Datasheet

Tube 326 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-324-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-324-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,421 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-424-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-424-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,100 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-624-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-624-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,238 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-324-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-324-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,892 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-424-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-424-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,744 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-624-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-624-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,043 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-328-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-13-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,983 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-650-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-650-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,788 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-650-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-650-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,991 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-950-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-950-41-117000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,590 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-950-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,979 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-93-324-41-001000

SOCKET CARRIER SLDRTL .300 24POS

Mill-Max Manufacturing Corp.
2,124 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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