Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-93-320-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-320-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,881 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-420-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-420-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,427 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-320-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,492 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-420-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-420-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,181 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6551-11 Aries Electronics Sockets for ICs, Transistors

24-6551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
2,426 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3554-11 Aries Electronics Sockets for ICs, Transistors

24-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
3,587 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
614-41-650-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-650-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,656 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-650-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-650-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,520 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-642-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,634 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-642-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,608 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-640-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,137 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-640-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,860 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-650-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-650-41-117000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,891 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-650-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-650-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,875 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-320-61-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-320-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,704 -

RFQ

Tube * Active - - - - - - - - - - - - - -
122-13-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,891 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,347 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-636-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-636-41-006000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,059 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-636-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,254 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-101-13-061001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-41-101-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,093 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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