Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-652-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-652-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,427 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-652-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,177 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6518-10E Aries Electronics Sockets for ICs, Transistors

48-6518-10E

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
2,602 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-43-648-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,477 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-648-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,582 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-636-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

124-41-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,480 -

RFQ

FudongIC

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-636-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

124-91-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,653 -

RFQ

FudongIC

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-168-17-101135 Preci-Dip Sockets for ICs, Transistors

546-83-168-17-101135

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,825 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 168 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-168-17-101136 Preci-Dip Sockets for ICs, Transistors

546-83-168-17-101136

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,167 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 168 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-419-19-111111 Preci-Dip Sockets for ICs, Transistors

517-87-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip
3,358 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 419 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-305-18-101111 Preci-Dip Sockets for ICs, Transistors

517-83-305-18-101111

CONN SOCKET PGA 305POS GOLD

Preci-Dip
2,290 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 305 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-93-640-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-93-640-41-003000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
3,376 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-640-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-43-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,011 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-114-13-062001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-114-13-062001

SOCKET SOLDERTAIL 114-PGA

Mill-Max Manufacturing Corp.
3,928 -

RFQ

Tube 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-526-11 Aries Electronics Sockets for ICs, Transistors

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
3,605 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-650-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,244 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
120-PGM13015-10 Aries Electronics Sockets for ICs, Transistors

120-PGM13015-10

CONN SOCKET PGA GOLD

Aries Electronics
2,401 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
127-41-652-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,276 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-652-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,174 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-652-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-652-31-012000

SOCKET CARRIER LOWPRO .600 52POS

Mill-Max Manufacturing Corp.
2,044 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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