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Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-43-648-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp. 		2,117 -

RFQ

FudongIC

Datasheet

 Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-164-41-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-93-164-41-012000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp. 		2,331 -

RFQ

FudongIC

Datasheet

 Tube 346 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-41-650-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp. 		3,307 -

RFQ

FudongIC

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-91-650-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp. 		3,541 -

RFQ

FudongIC

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-T-P Samtec Inc. Sockets for ICs, Transistors

APA-648-T-P

ADAPTER PLUG

Samtec Inc. 		3,782 -

RFQ

Tube APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
18-823-90 Aries Electronics Sockets for ICs, Transistors

18-823-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics 		2,287 -

RFQ

FudongIC

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
116-41-964-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,091 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-964-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,594 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-652-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-652-31-007000

SOCKET CARRIER LOWPRO .600 52POS

Mill-Max Manufacturing Corp. 		3,695 -

RFQ

FudongIC

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-652-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-652-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp. 		3,696 -

RFQ

FudongIC

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-636-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-43-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp. 		3,394 -

RFQ

FudongIC

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-636-41-004000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-93-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp. 		3,882 -

RFQ

FudongIC

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-952-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-952-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp. 		3,227 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-952-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,491 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,773 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,394 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-640-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-11-640-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp. 		3,648 -

RFQ

FudongIC

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-650-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-650-41-008000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp. 		3,057 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-650-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,344 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-642-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,547 -

RFQ

FudongIC

Datasheet

 Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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