Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-91-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-324-41-001000

SOCKET IC OPEN 3 LVL .300 24POS

Mill-Max Manufacturing Corp.
3,633 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-424-41-001000

SOCKET IC OPEN 3 LVL .400 24POS

Mill-Max Manufacturing Corp.
3,183 -

RFQ

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-624-41-001000

SOCKET IC OPEN 3 LVL .600 24POS

Mill-Max Manufacturing Corp.
3,017 -

RFQ

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-41-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,536 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-41-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,631 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-41-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,544 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-652-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-47-652-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,827 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-628-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,502 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-952-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,141 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-952-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,764 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-13-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
3,400 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-13-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,325 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-13-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,510 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-432-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-432-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,576 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-632-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-632-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,350 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-432-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-432-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,022 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-632-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-632-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,058 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-628-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-93-628-41-013000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,224 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-628-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-43-628-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,947 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-608-10-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

299-93-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
2,064 -

RFQ

FudongIC

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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