Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-93-324-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-324-31-007000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.
2,997 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-424-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-424-31-007000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.
2,527 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-624-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-624-31-007000

SOCKET CARRIER LOWPRO .600 24POS

Mill-Max Manufacturing Corp.
3,646 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-324-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-324-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,646 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-424-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-424-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,293 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-624-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,527 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-432-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,756 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-632-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,198 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-432-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,721 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,011 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,955 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,929 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,781 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,118 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,246 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,875 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-430-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,573 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-430-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-91-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,946 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-650-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-650-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,010 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-950-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-950-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,214 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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