Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-41-304-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,817 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-304-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-304-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
3,043 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-304-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-304-41-105000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.
3,783 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-304-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-304-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,471 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-656-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-43-656-41-005000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.
2,060 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-125-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-125-31-018000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.
3,594 -

RFQ

FudongIC

Datasheet

Bulk 714 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-137-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-93-137-41-013000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.
3,811 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-137-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-137-41-013000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.
2,274 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-304-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.
3,973 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-304-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-43-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,611 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-138-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-138-41-013000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.
2,631 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-44-628-01-670799 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

214-44-628-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.
3,948 -

RFQ

Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-99-628-01-670799 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

214-99-628-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.
2,587 -

RFQ

Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
116-47-304-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-304-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,209 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-320-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,879 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-138-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-93-138-41-013000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.
3,494 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-304-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-304-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,196 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-304-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-304-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,497 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-126-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-126-31-018000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.
2,464 -

RFQ

FudongIC

Datasheet

Bulk 714 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-304-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,974 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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