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Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-93-320-61-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-320-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,341 -

RFQ

Tube * Active - - - - - - - - - - - - - -
32-6621-30 Aries Electronics Sockets for ICs, Transistors

32-6621-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics 		2,863 -

RFQ

FudongIC

Datasheet

 Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-028-06-005001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-028-06-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,291 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-028-06-005002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-028-06-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,868 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-028-06-005003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-028-06-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,467 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-192-14-001135 Preci-Dip Sockets for ICs, Transistors

546-83-192-14-001135

CONN SOCKET PGA 192POS GOLD

Preci-Dip 		3,731 -

RFQ

FudongIC

Datasheet

 Bulk 546 Active PGA 192 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-192-14-001136 Preci-Dip Sockets for ICs, Transistors

546-83-192-14-001136

CONN SOCKET PGA 192POS GOLD

Preci-Dip 		2,254 -

RFQ

FudongIC

Datasheet

 Bulk 546 Active PGA 192 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
44-6556-11 Aries Electronics Sockets for ICs, Transistors

44-6556-11

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics 		2,078 -

RFQ

FudongIC

Datasheet

 Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
127-93-652-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-93-652-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp. 		3,628 -

RFQ

FudongIC

Datasheet

 Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-652-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-43-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,905 -

RFQ

FudongIC

Datasheet

 Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-6503-21 Aries Electronics Sockets for ICs, Transistors

22-6503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics 		2,639 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-31 Aries Electronics Sockets for ICs, Transistors

22-6503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics 		3,482 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-21 Aries Electronics Sockets for ICs, Transistors

24-6503-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics 		3,495 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-31 Aries Electronics Sockets for ICs, Transistors

24-6503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics 		3,026 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
126-93-648-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-648-41-002000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp. 		2,645 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-648-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,146 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-964-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-964-31-007000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp. 		2,795 -

RFQ

FudongIC

Datasheet

 Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-964-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-964-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp. 		3,538 -

RFQ

FudongIC

Datasheet

 Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-320-61-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-43-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,304 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-43-420-61-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-43-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,905 -

RFQ

Tube * Active - - - - - - - - - - - - - -
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