Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-628-61-006000

116-43-628-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,610 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-328-61-006000

116-93-328-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,105 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-428-61-006000

116-93-428-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,699 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-628-61-006000

116-93-628-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,177 -

RFQ

Tube * Active - - - - - - - - - - - - - -
517-87-528-21-121111

517-87-528-21-121111

CONN SOCKET PGA 528POS GOLD

Preci-Dip
2,787 -

RFQ

517-87-528-21-121111

Datasheet

Bulk 517 Active PGA 528 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-028-06-005001

510-13-028-06-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,405 -

RFQ

510-13-028-06-005001

Datasheet

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-028-06-005002

510-13-028-06-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,664 -

RFQ

510-13-028-06-005002

Datasheet

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-028-06-005003

510-13-028-06-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,104 -

RFQ

510-13-028-06-005003

Datasheet

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-650-61-001000

110-43-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,529 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-650-61-001000

110-93-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,332 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-320-61-001000

116-43-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,075 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-420-61-001000

116-43-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,378 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-320-61-001000

116-93-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,667 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-420-61-001000

116-93-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,198 -

RFQ

Tube * Active - - - - - - - - - - - - - -
20-3508-21

20-3508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,990 -

RFQ

20-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-31

20-3508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,358 -

RFQ

20-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
517-87-529-21-121111

517-87-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip
2,820 -

RFQ

517-87-529-21-121111

Datasheet

Bulk 517 Active PGA 529 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
126-41-964-41-002000

126-41-964-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,023 -

RFQ

126-41-964-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-964-41-002000

126-91-964-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,656 -

RFQ

126-91-964-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-632-G-P

APA-632-G-P

ADAPTER PLUG

Samtec Inc.
2,212 -

RFQ

Tube APA Active - 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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    1500+ Daily average RFQ Volume
    20,000.000
    20,000.000 Standard Product Unit
    1800+
    1800+ Worldwide Manufacturers
    15,000+
    15,000+ In-stock Warehouse
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