Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-081-09-000003

510-93-081-09-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,575 -

RFQ

510-93-081-09-000003

Datasheet

Bulk 510 Active PGA 81 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-081-12-071002

510-93-081-12-071002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,472 -

RFQ

510-93-081-12-071002

Datasheet

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-081-12-071003

510-93-081-12-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,637 -

RFQ

510-93-081-12-071003

Datasheet

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
326-93-164-41-003000

326-93-164-41-003000

SOCKET WRAP SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.
2,769 -

RFQ

326-93-164-41-003000

Datasheet

Tube 326 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3508-21

24-3508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,933 -

RFQ

24-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-31

24-3508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,359 -

RFQ

24-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-21

24-4508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,994 -

RFQ

24-4508-21

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-31

24-4508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,893 -

RFQ

24-4508-31

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-120-13-061002

510-91-120-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,483 -

RFQ

510-91-120-13-061002

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-120-13-061003

510-91-120-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,739 -

RFQ

510-91-120-13-061003

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-120-13-061001

510-91-120-13-061001

SOCKET SOLDERTAIL 120-PGA

Mill-Max Manufacturing Corp.
2,242 -

RFQ

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6508-21

24-6508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,996 -

RFQ

24-6508-21

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-31

24-6508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,254 -

RFQ

24-6508-31

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-121-13-061001

510-91-121-13-061001

SOCKET SOLDERTAIL 121-PGA

Mill-Max Manufacturing Corp.
2,282 -

RFQ

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-11-000001

510-91-121-11-000001

SOCKET SOLDERTAIL 121-PGA

Mill-Max Manufacturing Corp.
2,646 -

RFQ

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-15-061001

510-91-121-15-061001

SOCKET SOLDERTAIL 121-PGA

Mill-Max Manufacturing Corp.
2,384 -

RFQ

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-11-000002

510-91-121-11-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,982 -

RFQ

510-91-121-11-000002

Datasheet

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-11-000003

510-91-121-11-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,758 -

RFQ

510-91-121-11-000003

Datasheet

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-13-061002

510-91-121-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,844 -

RFQ

510-91-121-13-061002

Datasheet

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-121-13-061003

510-91-121-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,945 -

RFQ

510-91-121-13-061003

Datasheet

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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