Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-132-13-041002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-132-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,754 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-132-13-041003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-132-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,656 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-132-14-071003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-132-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,018 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-135-14-051001

SOCKET SOLDERTAIL 135-PGA

Mill-Max Manufacturing Corp.
3,122 -

RFQ

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-135-14-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,556 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-135-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,412 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-13-045002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-133-13-045002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,394 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-14-071002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-133-14-071002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,733 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-14-071003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-133-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,483 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6575-11 Aries Electronics Sockets for ICs, Transistors

40-6575-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,215 -

RFQ

FudongIC

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
514-83-292M20-001148 Preci-Dip Sockets for ICs, Transistors

514-83-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip
3,628 -

RFQ

FudongIC

Datasheet

Bulk 514 Active BGA 292 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-089-12-051001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-089-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,496 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-089-12-051002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-089-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,595 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-209-17-081002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-41-209-17-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,486 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-209-17-081003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,646 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-321-17-101147 Preci-Dip Sockets for ICs, Transistors

546-83-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip
2,770 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 321 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
64-9508-20 Aries Electronics Sockets for ICs, Transistors

64-9508-20

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,912 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-272M20-001105 Preci-Dip Sockets for ICs, Transistors

518-77-272M20-001105

CONN SOCKET PGA 272POS GOLD

Preci-Dip
2,252 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 272 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-91-223-18-095001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,523 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-223-18-095002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,861 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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