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Sockets for ICs, Transistors
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-93-196-14-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,696 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 196 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
546-83-321-19-121147CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,613 | - |
RFQ |
Datasheet |
Bulk | 546 | Active | PGA | 321 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
88-PGM13028-10HCONN SOCKET PGA GOLD Aries Electronics |
3,977 | - |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
517-83-565-21-111111CONN SOCKET PGA 565POS GOLD Preci-Dip |
2,048 | - |
RFQ |
Datasheet |
Bulk | 517 | Active | PGA | 565 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD Preci-Dip |
2,310 | - |
RFQ |
Datasheet |
Bulk | 514 | Active | BGA | 400 (20 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-91-238-19-086002SOCKET SOLDERTAIL 238-PGA Mill-Max Manufacturing Corp. |
3,403 | - |
RFQ |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-238-19-086001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,088 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-238-19-086003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,228 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-456M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,878 | - |
RFQ |
Datasheet |
Bulk | 550 | Active | BGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-13-108-12-051002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,704 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 108 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-108-12-051003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,885 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 108 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-108-12-051001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,316 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 108 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-256-16-000002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,924 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-256-16-000002SOCKET SOLDERTAIL 256-PGA Mill-Max Manufacturing Corp. |
2,671 | - |
RFQ |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-256-19-081002SOCKET SOLDERTAIL 256-PGA Mill-Max Manufacturing Corp. |
3,583 | - |
RFQ |
Bulk | 510 | Active | PGA | 256 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-256-16-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,902 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-256-16-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,761 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-256-19-081001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,100 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 256 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-256-19-081003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,216 | - |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 256 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
40-6508-212CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
2,782 | - |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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