Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-400M20-000152 Preci-Dip Sockets for ICs, Transistors

550-10-400M20-000152

BGA SOLDER TAIL

Preci-Dip
2,991 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-173-16-005001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-173-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,965 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-173-16-005002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-173-16-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,849 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-173-16-005003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-173-16-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,352 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
225-PGM15001-11 Aries Electronics Sockets for ICs, Transistors

225-PGM15001-11

CONN SOCKET PGA GOLD

Aries Electronics
3,212 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-357M19-001104 Preci-Dip Sockets for ICs, Transistors

558-10-357M19-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,005 -

RFQ

FudongIC

Datasheet

Bulk 558 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-576M30-001166 Preci-Dip Sockets for ICs, Transistors

550-10-576M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,387 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-356M26-001105 Preci-Dip Sockets for ICs, Transistors

518-77-356M26-001105

CONN SOCKET PGA 356POS GOLD

Preci-Dip
3,923 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 356 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
133-PGM13052-10H Aries Electronics Sockets for ICs, Transistors

133-PGM13052-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,454 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
133-PGM13067-10H Aries Electronics Sockets for ICs, Transistors

133-PGM13067-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,498 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
133-PGM14013-10H Aries Electronics Sockets for ICs, Transistors

133-PGM14013-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,129 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-357M19-001105 Preci-Dip Sockets for ICs, Transistors

518-77-357M19-001105

CONN SOCKET PGA 357POS GOLD

Preci-Dip
3,153 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 357 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-175-16-006002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-006002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,376 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-175-16-006003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-006003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,423 -

RFQ

FudongIC

Datasheet

Tube 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-175-16-005002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-005002

SOCKET SOLDERTAIL 175-PGA

Mill-Max Manufacturing Corp.
2,987 -

RFQ

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-175-16-005001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,667 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-175-16-005003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,374 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-175-16-006001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-175-16-006001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,869 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-323-21-005001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-323-21-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,223 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 323 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-323-21-005002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-323-21-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,507 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 323 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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