Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
558-10-576M30-001104 Preci-Dip Sockets for ICs, Transistors

558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,469 -

RFQ

FudongIC

Datasheet

Bulk 558 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-576M30-001105 Preci-Dip Sockets for ICs, Transistors

518-77-576M30-001105

CONN SOCKET PGA 576POS GOLD

Preci-Dip
2,951 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
42-3551-16 Aries Electronics Sockets for ICs, Transistors

42-3551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,345 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3552-16 Aries Electronics Sockets for ICs, Transistors

42-3552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,874 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3553-16 Aries Electronics Sockets for ICs, Transistors

42-3553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
3,333 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6551-16 Aries Electronics Sockets for ICs, Transistors

42-6551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,042 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6552-16 Aries Electronics Sockets for ICs, Transistors

42-6552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,213 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6553-16 Aries Electronics Sockets for ICs, Transistors

42-6553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,937 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3554-16 Aries Electronics Sockets for ICs, Transistors

42-3554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
2,049 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6554-16 Aries Electronics Sockets for ICs, Transistors

42-6554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics
3,433 -

RFQ

FudongIC

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
175-PGM16003-11 Aries Electronics Sockets for ICs, Transistors

175-PGM16003-11

CONN SOCKET PGA GOLD

Aries Electronics
3,019 -

RFQ

FudongIC

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
80-PRS13127-12 Aries Electronics Sockets for ICs, Transistors

80-PRS13127-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,796 -

RFQ

FudongIC

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
518-77-576M30-001106 Preci-Dip Sockets for ICs, Transistors

518-77-576M30-001106

CONN SOCKET PGA 576POS GOLD

Preci-Dip
2,924 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
44-PLS12017-12 Aries Electronics Sockets for ICs, Transistors

44-PLS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,230 -

RFQ

FudongIC

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-PRS12017-12 Aries Electronics Sockets for ICs, Transistors

44-PRS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,379 -

RFQ

FudongIC

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS10001-12 Aries Electronics Sockets for ICs, Transistors

100-PLS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,205 -

RFQ

FudongIC

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11010-12 Aries Electronics Sockets for ICs, Transistors

84-PRS11010-12

ZIF 11X11 84PIN FOOTPRN 11010

Aries Electronics
2,887 -

RFQ

- PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PLS10003-12 Aries Electronics Sockets for ICs, Transistors

84-PLS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,819 -

RFQ

FudongIC

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS10003-12 Aries Electronics Sockets for ICs, Transistors

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,437 -

RFQ

FudongIC

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11032-12 Aries Electronics Sockets for ICs, Transistors

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,727 -

RFQ

FudongIC

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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