Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
822473-4 TE Connectivity AMP Connectors Sockets for ICs, Transistors

822473-4

CONN SOCKET PLCC 44POS TIN-LEAD

TE Connectivity AMP Connectors
2,703 -

RFQ

FudongIC

Datasheet

Tube - Obsolete PLCC 44 (4 x 11) 0.050 (1.27mm) Tin-Lead - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic
AW-127A-20-Z Assmann WSW Components Sockets for ICs, Transistors

AW-127A-20-Z

CONN SOCKET SIP 20POS TIN

Assmann WSW Components
3,592 -

RFQ

FudongIC

Datasheet

- - Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Tin 78.7µin (2.00µm) - Through Hole Closed Frame - - - - - -
232-1297-00-3303 3M Sockets for ICs, Transistors

232-1297-00-3303

CONN IC DIP SOCKET ZIF 32POS GLD

3M
3,849 -

RFQ

FudongIC

Datasheet

Tube OEM Obsolete DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
22-16-4 Grayhill Inc. Sockets for ICs, Transistors

22-16-4

CONN TRANSIST TO-5 4POS GOLD

Grayhill Inc.
2,470 -

RFQ

Bulk,Bulk 22 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled
60-1518-10 Aries Electronics Sockets for ICs, Transistors

60-1518-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics
2,804 -

RFQ

FudongIC

Datasheet

Bulk 518 Obsolete DIP, 0.2 (5.08mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
390261-3 TE Connectivity AMP Connectors Sockets for ICs, Transistors

390261-3

CONN IC DIP SOCKET 14POS TINLEAD

TE Connectivity AMP Connectors
2,608 -

RFQ

FudongIC

Datasheet

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Phosphor Bronze -
AR06-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR06-HZL/01-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components
2,629 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR08-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR08-HZL/01-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components
3,320 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR14-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR14-HZL/01-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components
2,716 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR16-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR16-HZL/01-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
3,617 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR20-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR20-HZL/01-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
3,937 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR24-HZL/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
2,835 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZL/7/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR24-HZL/7/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
2,365 -

RFQ

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR48-HZL/01-TT Assmann WSW Components Sockets for ICs, Transistors

AR48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components
3,318 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR06-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR06-HZL/07-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components
3,497 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR08-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR08-HZL/07-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components
3,529 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR14-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR14-HZL/07-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components
3,156 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR16-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
3,191 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR18-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
2,489 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR20-HZL/07-TT Assmann WSW Components Sockets for ICs, Transistors

AR20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
2,870 -

RFQ

FudongIC

Datasheet

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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