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Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
100-016-050 3M Sockets for ICs, Transistors

100-016-050

CONN IC DIP SOCKET 16POS GOLD

3M 		3,178 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-016-051 3M Sockets for ICs, Transistors

100-016-051

CONN IC DIP SOCKET 16POS GOLD

3M 		3,783 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-018-050 3M Sockets for ICs, Transistors

100-018-050

CONN IC DIP SOCKET 18POS GOLD

3M 		3,381 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-018-051 3M Sockets for ICs, Transistors

100-018-051

CONN IC DIP SOCKET 18POS GOLD

3M 		3,557 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-050 3M Sockets for ICs, Transistors

100-020-050

CONN IC DIP SOCKET 20POS GOLD

3M 		3,642 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-051 3M Sockets for ICs, Transistors

100-020-051

CONN IC DIP SOCKET 20POS GOLD

3M 		3,538 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-022-050 3M Sockets for ICs, Transistors

100-022-050

CONN IC DIP SOCKET 22POS GOLD

3M 		2,763 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-024-051 3M Sockets for ICs, Transistors

100-024-051

CONN IC DIP SOCKET 24POS GOLD

3M 		3,201 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-050 3M Sockets for ICs, Transistors

100-028-050

CONN IC DIP SOCKET 28POS GOLD

3M 		3,718 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-051 3M Sockets for ICs, Transistors

100-028-051

CONN IC DIP SOCKET 28POS GOLD

3M 		2,985 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-050 3M Sockets for ICs, Transistors

100-032-050

CONN IC DIP SOCKET 32POS GOLD

3M 		3,772 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-051 3M Sockets for ICs, Transistors

100-032-051

CONN IC DIP SOCKET 32POS GOLD

3M 		3,906 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-050 3M Sockets for ICs, Transistors

100-040-050

CONN IC DIP SOCKET 40POS GOLD

3M 		2,211 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-051 3M Sockets for ICs, Transistors

100-040-051

CONN IC DIP SOCKET 40POS GOLD

3M 		3,341 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-042-050 3M Sockets for ICs, Transistors

100-042-050

CONN IC DIP SOCKET 42POS GOLD

3M 		2,068 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-048-050 3M Sockets for ICs, Transistors

100-048-050

CONN IC DIP SOCKET 48POS GOLD

3M 		2,320 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
110-024-050 3M Sockets for ICs, Transistors

110-024-050

CONN IC DIP SOCKET 24POS GOLD

3M 		3,393 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-024-050 3M Sockets for ICs, Transistors

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M 		2,008 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-028-050 3M Sockets for ICs, Transistors

130-028-050

CONN IC DIP SOCKET 28POS GOLD

3M 		3,862 -

RFQ

FudongIC

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
300-032-050 3M Sockets for ICs, Transistors

300-032-050

CONN SOCKET SIP 32POS GOLD

3M 		3,284 -

RFQ

Box 300 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
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