Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
54-PRS17038-16 Aries Electronics Sockets for ICs, Transistors

54-PRS17038-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,396 -

RFQ

FudongIC

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PLS11033-16 Aries Electronics Sockets for ICs, Transistors

68-PLS11033-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,503 -

RFQ

FudongIC

Datasheet

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PRS11033-16 Aries Electronics Sockets for ICs, Transistors

68-PRS11033-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,327 -

RFQ

FudongIC

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
80-PRL13127-12 Aries Electronics Sockets for ICs, Transistors

80-PRL13127-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,126 -

RFQ

FudongIC

Datasheet

Bulk PRL Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
80-PRL15072-12 Aries Electronics Sockets for ICs, Transistors

80-PRL15072-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,648 -

RFQ

FudongIC

Datasheet

Bulk PRL Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11010-16 Aries Electronics Sockets for ICs, Transistors

84-PRS11010-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,863 -

RFQ

FudongIC

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11032-16 Aries Electronics Sockets for ICs, Transistors

84-PRS11032-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,372 -

RFQ

FudongIC

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
34-6511-10 Aries Electronics Sockets for ICs, Transistors

34-6511-10

CONN IC DIP SOCKET 34POS TIN

Aries Electronics
3,268 -

RFQ

FudongIC

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-6511-11 Aries Electronics Sockets for ICs, Transistors

34-6511-11

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,227 -

RFQ

FudongIC

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4511-10 Aries Electronics Sockets for ICs, Transistors

22-4511-10

CONN IC DIP SOCKET 22POS TIN

Aries Electronics
2,328 -

RFQ

FudongIC

Datasheet

Bulk 511 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4511-11 Aries Electronics Sockets for ICs, Transistors

22-4511-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,962 -

RFQ

FudongIC

Datasheet

Bulk 511 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
1109822 Aries Electronics Sockets for ICs, Transistors

1109822

501 DIP TEST SCKT SOLDER TAIL

Aries Electronics
2,825 -

RFQ

FudongIC

Datasheet

- - Active - - - - - - - - - - - - - -
14-3501-40 Aries Electronics Sockets for ICs, Transistors

14-3501-40

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,241 -

RFQ

FudongIC

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4501-20 Aries Electronics Sockets for ICs, Transistors

22-4501-20

CONN IC DIP SOCKET 22POS TIN

Aries Electronics
2,727 -

RFQ

FudongIC

Datasheet

Bulk 501 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4501-21 Aries Electronics Sockets for ICs, Transistors

22-4501-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,912 -

RFQ

FudongIC

Datasheet

Bulk 501 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4501-30 Aries Electronics Sockets for ICs, Transistors

22-4501-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics
2,380 -

RFQ

FudongIC

Datasheet

Bulk 501 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4501-31 Aries Electronics Sockets for ICs, Transistors

22-4501-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,163 -

RFQ

FudongIC

Datasheet

Bulk 501 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
4778-115-12 Aries Electronics Sockets for ICs, Transistors

4778-115-12

501 DIP TEST SCKT SOLDER TAIL

Aries Electronics
2,675 -

RFQ

FudongIC

Datasheet

- - Active - - - - - - - - - - - - - -
1107557 Aries Electronics Sockets for ICs, Transistors

1107557

0511 STRIP-LINE SCKT W/SOLDER TL

Aries Electronics
3,886 -

RFQ

FudongIC

Datasheet

- - Active - - - - - - - - - - - - - -
0500-0.300 Aries Electronics Sockets for ICs, Transistors

0500-0.300

0511 STRIP-LINE SCKT W/SOLDER TL

Aries Electronics
3,405 -

RFQ

FudongIC

Datasheet

- - Active - - - - - - - - - - - - - -
Total 21991 Records«Prev1... 807808809810811812813814...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • FudongIC
    1500+ Daily average RFQ Volume
    FudongIC
    20,000.000 Standard Product Unit
    FudongIC
    1800+ Worldwide Manufacturers
    FudongIC
    15,000+ In-stock Warehouse
    FudongIC

    HOME

    FudongIC

    PRODUCT

    FudongIC

    PHONE

    FudongIC

    USER