Solder

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
NC3SWLF.031 0.5OZ Chip Quik Inc. Solder

NC3SWLF.031 0.5OZ

LF SOLDER WIRE MINI POCKET PACK

Chip Quik Inc.
2,238 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Sn96.5Ag3.5 (96.5/3.5) 0.031 (0.79mm) 430°F (221°C) No-Clean 20 AWG, 21 SWG - - Tube, 0.50 oz (14.17g) - -
NC3SWLF.020 0.3OZ Chip Quik Inc. Solder

NC3SWLF.020 0.3OZ

LF SOLDER WIRE MINI POCKET PACK

Chip Quik Inc.
2,735 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Sn96.5Ag3.5 (96.5/3.5) 0.020 (0.51mm) 430°F (221°C) No-Clean 24 AWG, 25 SWG - - Tube, 0.3 oz (8.51g) - -
NC3SW.031 0.5OZ Chip Quik Inc. Solder

NC3SW.031 0.5OZ

SOLDER WIRE MINI POCKET PACK 62/

Chip Quik Inc.
2,700 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.031 (0.79mm) 354°F (179°C) No-Clean 20 AWG, 21 SWG - Leaded Tube, 0.50 oz (14.17g) - -
NC3SW.020 0.3OZ Chip Quik Inc. Solder

NC3SW.020 0.3OZ

SOLDER WIRE MINI POCKET PACK 62/

Chip Quik Inc.
3,792 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.020 (0.51mm) 354°F (179°C) No-Clean 24 AWG, 25 SWG - Leaded Tube, 0.3 oz (8.51g) - -
NC2SWLF.015 0.2OZ Chip Quik Inc. Solder

NC2SWLF.015 0.2OZ

LF SOLDER WIRE MINI POCKET PACK

Chip Quik Inc.
3,922 -

RFQ

FudongIC

Datasheet

Bulk CHIPQUIK® Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.015 (0.38mm) 441°F (227°C) No-Clean - - - Tube, 0.2 oz (5.66g) - -
NC2SW.015 0.2OZ Chip Quik Inc. Solder

NC2SW.015 0.2OZ

SOLDER WIRE MINI POCKET PACK 60/

Chip Quik Inc.
3,100 -

RFQ

FudongIC

Datasheet

Bulk CHIPQUIK® Active Wire Solder Sn60Pb40 (60/40) 0.015 (0.38mm) 361°F ~ 370°F (183°C ~ 188°C) No-Clean - - Leaded Tube, 0.2 oz (5.66g) - -
NC2SW.015 1OZ Chip Quik Inc. Solder

NC2SW.015 1OZ

SOLDER WIRE 60/40 TIN/LEAD (SN60

Chip Quik Inc.
3,512 -

RFQ

FudongIC

Datasheet

Bulk CHIPQUIK® Active Wire Solder Sn60Pb40 (60/40) 0.015 (0.38mm) 361°F ~ 370°F (183°C ~ 188°C) No-Clean - - Leaded Spool, 1 oz (28.35g) - -
TS391AX50 Chip Quik Inc. Solder

TS391AX50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,861 -

RFQ

FudongIC

Datasheet

Bulk - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 1.76 oz (50g) 12 Months Date of Manufacture
SMD2215-25000 Chip Quik Inc. Solder

SMD2215-25000

SOLDER SPHERES SN63/PB37 .030 D

Chip Quik Inc.
2,178 -

RFQ

FudongIC

Datasheet

Jar SMD2 Active Solder Sphere Sn63Pb37 (63/37) 0.030 (0.76mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture
SMD2205-25000 Chip Quik Inc. Solder

SMD2205-25000

SOLDER SPHERES SN63/PB37 .025 D

Chip Quik Inc.
2,601 -

RFQ

FudongIC

Datasheet

Jar SMD2 Active Solder Sphere Sn63Pb37 (63/37) 0.025 (0.64mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture
EXB-SN96.5AG3.0CU0.5-0.5LB Chip Quik Inc. Solder

EXB-SN96.5AG3.0CU0.5-0.5LB

SOLDER BAR SN96.5/AG3.0/CU0.5 0.

Chip Quik Inc.
3,699 -

RFQ

FudongIC

Datasheet

Bulk Super Low Dross™ Active Bar Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) - - - Leaded Bar, 0.5 lb (227g) - -
NC4SW.031 1LB Chip Quik Inc. Solder

NC4SW.031 1LB

SOLDER WIRE 93.5/5/1.5 LEAD/TIN/

Chip Quik Inc.
2,211 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 0.031 (0.79mm) 565 ~ 574°F (296 ~ 301°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - -
NC4SW.020 1LB Chip Quik Inc. Solder

NC4SW.020 1LB

SOLDER WIRE 93.5/5/1.5 LEAD/TIN/

Chip Quik Inc.
2,779 -

RFQ

FudongIC

Datasheet

Bulk - Active Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 0.020 (0.51mm) 565 ~ 574°F (296 ~ 301°C) No-Clean 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) - -
SMD2SWLF.031 8OZ Chip Quik Inc. Solder

SMD2SWLF.031 8OZ

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Chip Quik Inc.
2,723 -

RFQ

FudongIC

Datasheet

Bulk SMD2 Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.031 (0.79mm) 441°F (227°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - -
SMD2SW.031 .7OZ Chip Quik Inc. Solder

SMD2SW.031 .7OZ

SOLDER WIRE POCKET PACK 60/40 TI

Chip Quik Inc.
2,708 -

RFQ

FudongIC

Datasheet

Bulk SMD2 Active Wire Solder Sn60Pb40 (60/40) 0.031 (0.79mm) 361 ~ 370°F (183 ~ 188°C) No-Clean, Water Soluble 20 AWG, 21 SWG - Leaded Tube, 0.7 oz (19.85g) - -
TS391LT250 Chip Quik Inc. Solder

TS391LT250

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,574 -

RFQ

FudongIC

Datasheet

Bulk - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture
SMD291AX250T5 Chip Quik Inc. Solder

SMD291AX250T5

SOLDER PASTE SN63/PB37 250G T5

Chip Quik Inc.
3,159 -

RFQ

FudongIC

Datasheet

Jar - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture
WS991SNL500T4 Chip Quik Inc. Solder

WS991SNL500T4

SOLDER PASTE THERMALLY STABLE WS

Chip Quik Inc.
3,710 -

RFQ

FudongIC

Datasheet

Bulk CHIPQUIK® Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) Water Soluble - 4 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture
SMD2200-25000 Chip Quik Inc. Solder

SMD2200-25000

SOLDER SPHERES SN63/PB37 .024 D

Chip Quik Inc.
3,634 -

RFQ

FudongIC

Datasheet

Jar SMD2 Active Solder Sphere Sn63Pb37 (63/37) 0.024 (0.61mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture
SMD2190-25000 Chip Quik Inc. Solder

SMD2190-25000

SOLDER SPHERES SN63/PB37 .020 D

Chip Quik Inc.
2,955 -

RFQ

FudongIC

Datasheet

Jar SMD2 Active Solder Sphere Sn63Pb37 (63/37) 0.020 (0.51mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture
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