114990107 Seeed Technology Co., Ltd

Part No.:
114990107
Manufacturer:
Seeed Technology Co., Ltd
Category:
Force Sensors
Package:
Datasheet:
114990107 PDF datasheet icon114990107.pdf
Description:
0.2 THIN FILM RES PRESSURE SNSR
Quantity:

Unit Price:Request Quote

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Product Details

114990107 Frequently Asked Questions

Is 114990107 currently in stock? ▼

FudongIC currently shows 2,208 units of 114990107 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 114990107? ▼

The minimum order quantity currently shown for 114990107 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 114990107 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 114990107, please note this in your RFQ.

Can you provide a datasheet or technical support for 114990107? ▼

Yes. You can view or download the 114990107.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 114990107, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 114990107? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 114990107. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 114990107? ▼

As a Force Sensors product from Seeed Technology Co., Ltd, 114990107 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

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