All Categories

View More Product Categories >>

163PC01D75 Honeywell Sensing and Productivity Solutions

Part No.:: 163PC01D75

Manufacturer:: Honeywell Sensing and Productivity Solutions

Category:: Pressure Sensors, Transducers

Package:: 3-SIP Module

Datasheet:: 163PC01D75.pdf

Description:: SENSOR PRESS DIFF 2.5 H2O 3SIP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is 163PC01D75 Suitable For?

163PC01D75 is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Pressure Sensors, Transducers components. Engineers can review the 163PC01D75 datasheet, package 3-SIP Module and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Honeywell Sensing and Productivity Solutions components are required, helping engineers evaluate 163PC01D75 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 163PC01D75 description, package 3-SIP Module and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 163PC01D75 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 163PC01D75 Pricing & Technical Support

Product Overview

163PC01D75 is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions. It is supplied in package 3-SIP Module and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 163PC01D75 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR PRESS DIFF 2.5 H2O 3SIP

Key Features

Part Number:163PC01D75
Manufacturer:Honeywell Sensing and Productivity Solutions
Category:Pressure Sensors, Transducers
Package:3-SIP Module
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

163PC01D75 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 163PC01D75 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

3-SIP Module
Packaging:

Bulk
Series:

160PC
ProductStatus:

Active
Applications:

Board Mount
PressureType:

Differential
OperatingPressure:

±0.09PSI (±0.62kPa)
OutputType:

Analog Voltage
Output:

3.5 V ~ 8.5 V
Accuracy:

±2%
Voltage-Supply:

6V ~ 16V
PortSize:

Male - 0.2 (5mm) Tube, Dual
PortStyle:

Barbless
Features:

Amplified Output, Temperature Compensated
TerminationStyle:

PC Pin
MaximumPressure:

±5PSI (±34.47kPa)
OperatingTemperature:

-40°C ~ 85°C
Category:

Pressure Sensors, Transducers
Datasheet:

163PC01D75.pdf

163PC01D75 Frequently Asked Questions

Is 163PC01D75 currently in stock? ▼

FudongIC currently shows 3,142 units of 163PC01D75 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 163PC01D75? ▼

The minimum order quantity currently shown for 163PC01D75 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 163PC01D75 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 163PC01D75, please note this in your RFQ.

Can you provide a datasheet or technical support for 163PC01D75? ▼

Yes. You can view or download the 163PC01D75.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 163PC01D75, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 163PC01D75? ▼

Yes. Based on your application, preferred manufacturer, package 3-SIP Module, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 163PC01D75. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 163PC01D75? ▼

As a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, 163PC01D75 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.