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1SX210HU3F50I3VGAS Intel

Part No.:: 1SX210HU3F50I3VGAS

Manufacturer:: Intel

Category:: Embedded - System On Chip (SoC)

Package:: 2397-BBGA, FCBGA

Datasheet:: 1SX210HU3F50I3VGAS.pdf

Description:: IC FPGA STRATIX 10 2397FBGA

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is 1SX210HU3F50I3VGAS Suitable For?

1SX210HU3F50I3VGAS is a Embedded - System On Chip (SoC) product from Intel, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - System On Chip (SoC) components. Engineers can review the 1SX210HU3F50I3VGAS datasheet, package 2397-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Intel components are required, helping engineers evaluate 1SX210HU3F50I3VGAS specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 1SX210HU3F50I3VGAS description, package 2397-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 1SX210HU3F50I3VGAS datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 1SX210HU3F50I3VGAS Pricing & Technical Support

Product Overview

1SX210HU3F50I3VGAS is a Embedded - System On Chip (SoC) product from Intel. It is supplied in package 2397-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 1SX210HU3F50I3VGAS datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC FPGA STRATIX 10 2397FBGA

Key Features

Part Number:1SX210HU3F50I3VGAS
Manufacturer:Intel
Category:Embedded - System On Chip (SoC)
Package:2397-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

1SX210HU3F50I3VGAS may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 1SX210HU3F50I3VGAS stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

2397-BBGA, FCBGA
Packaging:

Tray
Series:

Stratix® 10 SX
ProductStatus:

Active
Architecture:

MCU, FPGA
CoreProcessor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
FlashSize:

-
RAMSize:

256KB
Peripherals:

DMA, WDT
Connectivity:

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:

1.5GHz
PrimaryAttributes:

FPGA - 2100K Logic Elements
OperatingTemperature:

-40°C ~ 100°C (TJ)
Category:

Embedded - System On Chip (SoC)
Datasheet:

1SX210HU3F50I3VGAS.pdf

1SX210HU3F50I3VGAS Frequently Asked Questions

Is 1SX210HU3F50I3VGAS currently in stock? ▼

FudongIC currently shows 2,322 units of 1SX210HU3F50I3VGAS in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 1SX210HU3F50I3VGAS? ▼

The minimum order quantity currently shown for 1SX210HU3F50I3VGAS is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 1SX210HU3F50I3VGAS original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 1SX210HU3F50I3VGAS, please note this in your RFQ.

Can you provide a datasheet or technical support for 1SX210HU3F50I3VGAS? ▼

Yes. You can view or download the 1SX210HU3F50I3VGAS.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 1SX210HU3F50I3VGAS, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 1SX210HU3F50I3VGAS? ▼

Yes. Based on your application, preferred manufacturer, package 2397-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 1SX210HU3F50I3VGAS. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 1SX210HU3F50I3VGAS? ▼

As a Embedded - System On Chip (SoC) product from Intel, 1SX210HU3F50I3VGAS may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.