2008900108 Molex

Part No.:
2008900108
Manufacturer:
Molex
Category:
Card Edge Connectors - Housings
Package:
Datasheet:
2008900108 PDF datasheet icon2008900108.pdf
Description:
EDGELOCK 8-CKT HSG FOR 1.6MM PCB
Quantity:

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:
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Product Details

2008900108 Frequently Asked Questions

Is 2008900108 currently in stock? ▼

FudongIC currently shows 471 units of 2008900108 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 2008900108? ▼

The minimum order quantity currently shown for 2008900108 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 2008900108 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 2008900108, please note this in your RFQ.

Can you provide a datasheet or technical support for 2008900108? ▼

Yes. You can view or download the 2008900108.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 2008900108, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 2008900108? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 2008900108. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 2008900108? ▼

As a Card Edge Connectors - Housings product from Molex, 2008900108 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

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