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4515DO-DS3BK005GP TE Connectivity Measurement Specialties

Part No.:: 4515DO-DS3BK005GP

Manufacturer:: TE Connectivity Measurement Specialties

Category:: Pressure Sensors, Transducers

Package:: 8-DIP Module

Datasheet:: 4515DO-DS3BK005GP.pdf

Description:: SENSOR PRESS GAUGE

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is 4515DO-DS3BK005GP Suitable For?

4515DO-DS3BK005GP is a Pressure Sensors, Transducers product from TE Connectivity Measurement Specialties, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Pressure Sensors, Transducers components. Engineers can review the 4515DO-DS3BK005GP datasheet, package 8-DIP Module and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original TE Connectivity Measurement Specialties components are required, helping engineers evaluate 4515DO-DS3BK005GP specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 4515DO-DS3BK005GP description, package 8-DIP Module and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 4515DO-DS3BK005GP datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 4515DO-DS3BK005GP Pricing & Technical Support

Product Overview

4515DO-DS3BK005GP is a Pressure Sensors, Transducers product from TE Connectivity Measurement Specialties. It is supplied in package 8-DIP Module and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 4515DO-DS3BK005GP datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR PRESS GAUGE

Key Features

Part Number:4515DO-DS3BK005GP
Manufacturer:TE Connectivity Measurement Specialties
Category:Pressure Sensors, Transducers
Package:8-DIP Module
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

4515DO-DS3BK005GP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 4515DO-DS3BK005GP stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-DIP Module
Packaging:

Tray
Series:

-
ProductStatus:

Active
Applications:

Board Mount
PressureType:

Vented Gauge
OperatingPressure:

0.18PSI (1.25kPa)
OutputType:

I²C
Output:

14 b
Accuracy:

±0.25%
Voltage-Supply:

3.3V
PortSize:

Male - 0.14 (3.56mm) Tube, Dual
PortStyle:

Barbed
Features:

Temperature Compensated
TerminationStyle:

PC Pin
MaximumPressure:

10PSI (68.95kPa)
OperatingTemperature:

-10°C ~ 85°C
Category:

Pressure Sensors, Transducers
Datasheet:

4515DO-DS3BK005GP.pdf

4515DO-DS3BK005GP Frequently Asked Questions

Is 4515DO-DS3BK005GP currently in stock? ▼

FudongIC currently shows 3,280 units of 4515DO-DS3BK005GP in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 4515DO-DS3BK005GP? ▼

The minimum order quantity currently shown for 4515DO-DS3BK005GP is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 4515DO-DS3BK005GP original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 4515DO-DS3BK005GP, please note this in your RFQ.

Can you provide a datasheet or technical support for 4515DO-DS3BK005GP? ▼

Yes. You can view or download the 4515DO-DS3BK005GP.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 4515DO-DS3BK005GP, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 4515DO-DS3BK005GP? ▼

Yes. Based on your application, preferred manufacturer, package 8-DIP Module, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 4515DO-DS3BK005GP. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 4515DO-DS3BK005GP? ▼

As a Pressure Sensors, Transducers product from TE Connectivity Measurement Specialties, 4515DO-DS3BK005GP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.