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566010B03400G Aavid, Thermal Division of Boyd Corporation

Part No.:: 566010B03400G

Manufacturer:: Aavid, Thermal Division of Boyd Corporation

Category:: Thermal - Heat Sinks

Package:: Multiwatt, SIP

Datasheet:: 566010B03400G.pdf

Description:: HEATSINK W/TAB BLACK

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is 566010B03400G Suitable For?

566010B03400G is a Thermal - Heat Sinks product from Aavid, Thermal Division of Boyd Corporation, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the 566010B03400G datasheet, package Multiwatt, SIP and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Aavid, Thermal Division of Boyd Corporation components are required, helping engineers evaluate 566010B03400G specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 566010B03400G description, package Multiwatt, SIP and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 566010B03400G datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 566010B03400G Pricing & Technical Support

Product Overview

566010B03400G is a Thermal - Heat Sinks product from Aavid, Thermal Division of Boyd Corporation. It is supplied in package Multiwatt, SIP and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 566010B03400G datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: HEATSINK W/TAB BLACK

Key Features

Part Number:566010B03400G
Manufacturer:Aavid, Thermal Division of Boyd Corporation
Category:Thermal - Heat Sinks
Package:Multiwatt, SIP
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

566010B03400G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 566010B03400G stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
Type:

Board Level, Vertical
PackageCooled:

Clip and PC Pin
AttachmentMethod:

Rectangular, Fins
Shape:

1.220 (30.99mm)
Length:

1.000 (25.40mm)
Width:

-
Diameter:

0.500 (12.70mm)
FinHeight:

2.0W @ 30°C
PowerDissipation@TemperatureRise:

4.00°C/W @ 300 LFM
ThermalResistance@ForcedAirFlow:

11.50°C/W
ThermalResistance@Natural:

Aluminum
Material:
Category:

Thermal - Heat Sinks
Datasheet:

566010B03400G.pdf

566010B03400G Frequently Asked Questions

Is 566010B03400G currently in stock? ▼

FudongIC currently shows 9,830 units of 566010B03400G in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 566010B03400G? ▼

The minimum order quantity currently shown for 566010B03400G is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 566010B03400G original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 566010B03400G, please note this in your RFQ.

Can you provide a datasheet or technical support for 566010B03400G? ▼

Yes. You can view or download the 566010B03400G.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 566010B03400G, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 566010B03400G? ▼

Yes. Based on your application, preferred manufacturer, package Multiwatt, SIP, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 566010B03400G. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 566010B03400G? ▼

As a Thermal - Heat Sinks product from Aavid, Thermal Division of Boyd Corporation, 566010B03400G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.