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607DCR2R3SVB Cornell Dubilier / Illinois Capacitor

Part No.:: 607DCR2R3SVB

Manufacturer:: Cornell Dubilier / Illinois Capacitor

Category:: Electric Double Layer Capacitors (EDLC), Supercapacitors

Package:: Radial, Can - Snap-In

Datasheet:: 607DCR2R3SVB.pdf

Description:: CAP 600F -20% +50% 2.3V T/H

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is 607DCR2R3SVB Suitable For?

607DCR2R3SVB is a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Cornell Dubilier / Illinois Capacitor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Electric Double Layer Capacitors (EDLC), Supercapacitors components. Engineers can review the 607DCR2R3SVB datasheet, package Radial, Can - Snap-In and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Cornell Dubilier / Illinois Capacitor components are required, helping engineers evaluate 607DCR2R3SVB specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 607DCR2R3SVB description, package Radial, Can - Snap-In and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 607DCR2R3SVB datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 607DCR2R3SVB Pricing & Technical Support

Product Overview

607DCR2R3SVB is a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Cornell Dubilier / Illinois Capacitor. It is supplied in package Radial, Can - Snap-In and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 607DCR2R3SVB datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CAP 600F -20% +50% 2.3V T/H

Key Features

Part Number:607DCR2R3SVB
Manufacturer:Cornell Dubilier / Illinois Capacitor
Category:Electric Double Layer Capacitors (EDLC), Supercapacitors
Package:Radial, Can - Snap-In
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

607DCR2R3SVB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 607DCR2R3SVB stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

Radial, Can - Snap-In
Packaging:

Bulk
Series:

DCR
ProductStatus:

Active
Capacitance:

600 F
Tolerance:

-20%, +50%
Voltage-Rated:

2.3 V
ESR(EquivalentSeriesResistance):

-
Lifetime@Temp:

1000 Hrs @ 70°C
Termination:

PC Pins
MountingType:

Through Hole
LeadSpacing:

0.394 (10.00mm)
Size/Dimension:

1.181 Dia (30.00mm)
Height-Seated(Max):

2.441 (62.00mm)
Category:

Electric Double Layer Capacitors (EDLC), Supercapacitors
Datasheet:

607DCR2R3SVB.pdf

607DCR2R3SVB Frequently Asked Questions

Is 607DCR2R3SVB currently in stock? ▼

FudongIC currently shows 3,454 units of 607DCR2R3SVB in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 607DCR2R3SVB? ▼

The minimum order quantity currently shown for 607DCR2R3SVB is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 607DCR2R3SVB original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 607DCR2R3SVB, please note this in your RFQ.

Can you provide a datasheet or technical support for 607DCR2R3SVB? ▼

Yes. You can view or download the 607DCR2R3SVB.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 607DCR2R3SVB, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 607DCR2R3SVB? ▼

Yes. Based on your application, preferred manufacturer, package Radial, Can - Snap-In, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 607DCR2R3SVB. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 607DCR2R3SVB? ▼

As a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Cornell Dubilier / Illinois Capacitor, 607DCR2R3SVB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.