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61083-184402LF Amphenol ICC (FCI)

Part No.:: 61083-184402LF

Manufacturer:: Amphenol ICC (FCI)

Category:: Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

Package:

Datasheet:: 61083-184402LF.pdf

Description:: CONN PLUG 180POS SMD GOLD

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is 61083-184402LF Suitable For?

61083-184402LF is a Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product from Amphenol ICC (FCI), suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) components. Engineers can review the 61083-184402LF datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Amphenol ICC (FCI) components are required, helping engineers evaluate 61083-184402LF specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 61083-184402LF description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 61083-184402LF datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 61083-184402LF Pricing & Technical Support

Product Overview

61083-184402LF is a Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product from Amphenol ICC (FCI). It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 61083-184402LF datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CONN PLUG 180POS SMD GOLD

Key Features

Part Number:61083-184402LF
Manufacturer:Amphenol ICC (FCI)
Category:Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

61083-184402LF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 61083-184402LF stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

BergStak® 0.80mm
ProductStatus:

Active
ConnectorType:

Plug, Center Strip Contacts
NumberofPositions:

180
Pitch:

0.031 (0.80mm)
NumberofRows:

2
MountingType:

Surface Mount
Features:

Board Guide
ContactFinish:

Gold
ContactFinishThickness:

8.00µin (0.203µm)
MatedStackingHeights:

8mm, 12mm, 16mm
Category:

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Datasheet:

61083-184402LF.pdf

61083-184402LF Frequently Asked Questions

Is 61083-184402LF currently in stock? ▼

FudongIC currently shows 3,175 units of 61083-184402LF in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 61083-184402LF? ▼

The minimum order quantity currently shown for 61083-184402LF is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 61083-184402LF original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 61083-184402LF, please note this in your RFQ.

Can you provide a datasheet or technical support for 61083-184402LF? ▼

Yes. You can view or download the 61083-184402LF.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 61083-184402LF, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 61083-184402LF? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 61083-184402LF. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 61083-184402LF? ▼

As a Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product from Amphenol ICC (FCI), 61083-184402LF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.