67402J Advanced Micro Devices

Part No.:
67402J
Manufacturer:
Advanced Micro Devices
Category:
Logic - FIFOs Memory
Package:
16-CDIP
Datasheet:
67402J PDF datasheet icon67402J.pdf
Description:
FIFO, 64X5, 60NS, ASYNCHRONOUS
Quantity:

Unit Price:Request Quote

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Product Details

67402J Frequently Asked Questions

Is 67402J currently in stock? ▼

FudongIC currently shows 2,207 units of 67402J in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 67402J? ▼

The minimum order quantity currently shown for 67402J is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 67402J original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 67402J, please note this in your RFQ.

Can you provide a datasheet or technical support for 67402J? ▼

Yes. You can view or download the 67402J.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 67402J, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 67402J? ▼

Yes. Based on your application, preferred manufacturer, package 16-CDIP, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 67402J. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 67402J? ▼

As a Logic - FIFOs Memory product from Advanced Micro Devices, 67402J may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

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