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74LV4052N,112 NXP USA Inc.

Part No.:: 74LV4052N,112

Manufacturer:: NXP USA Inc.

Category:: Interface - Analog Switches, Multiplexers, Demultiplexers

Package:: 16-DIP (0.300, 7.62mm)

Datasheet:: 74LV4052N,112.pdf

Description:: IC MUX/DEMUX DUAL 4X1 16DIP

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Application Scenarios

What Applications Is 74LV4052N,112 Suitable For?

74LV4052N,112 is a Interface - Analog Switches, Multiplexers, Demultiplexers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Analog Switches, Multiplexers, Demultiplexers components. Engineers can review the 74LV4052N,112 datasheet, package 16-DIP (0.300, 7.62mm) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate 74LV4052N,112 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the 74LV4052N,112 description, package 16-DIP (0.300, 7.62mm) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports 74LV4052N,112 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for 74LV4052N,112 Pricing & Technical Support

Product Overview

74LV4052N,112 is a Interface - Analog Switches, Multiplexers, Demultiplexers product from NXP USA Inc.. It is supplied in package 16-DIP (0.300, 7.62mm) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide 74LV4052N,112 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MUX/DEMUX DUAL 4X1 16DIP

Key Features

Part Number:74LV4052N,112
Manufacturer:NXP USA Inc.
Category:Interface - Analog Switches, Multiplexers, Demultiplexers
Package:16-DIP (0.300, 7.62mm)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

74LV4052N,112 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for 74LV4052N,112 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

16-DIP (0.300, 7.62mm)
Packaging:

Tube,Tube
Series:

-
ProductStatus:

Obsolete
SwitchCircuit:

SP4T
Multiplexer/DemultiplexerCircuit:

4:1
NumberofCircuits:

2
On-StateResistance(Max):

85Ohm
Channel-to-ChannelMatching(ΔRon):

2Ohm
Voltage-SupplySingle(V+):

1V ~ 6V
Voltage-SupplyDual(V±):

-
SwitchTime(TonToff)(Max):

46ns, 32ns
-3dbBandwidth:

200MHz
ChargeInjection:

-
ChannelCapacitance(CS(off)CD(off)):

3.5pF
Current-Leakage(IS(off))(Max):

2µA
Crosstalk:

-60dB @ 1MHz
OperatingTemperature:

-40°C ~ 125°C (TA)
MountingType:

Through Hole
Category:

Interface - Analog Switches, Multiplexers, Demultiplexers
Datasheet:

74LV4052N,112.pdf

74LV4052N,112 Frequently Asked Questions

Is 74LV4052N,112 currently in stock? ▼

FudongIC currently shows 1,140 units of 74LV4052N,112 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for 74LV4052N,112? ▼

The minimum order quantity currently shown for 74LV4052N,112 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is 74LV4052N,112 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for 74LV4052N,112, please note this in your RFQ.

Can you provide a datasheet or technical support for 74LV4052N,112? ▼

Yes. You can view or download the 74LV4052N,112.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for 74LV4052N,112, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for 74LV4052N,112? ▼

Yes. Based on your application, preferred manufacturer, package 16-DIP (0.300, 7.62mm), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for 74LV4052N,112. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use 74LV4052N,112? ▼

As a Interface - Analog Switches, Multiplexers, Demultiplexers product from NXP USA Inc., 74LV4052N,112 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.