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ADC08DJ3200AAV Texas Instruments

Part No.:: ADC08DJ3200AAV

Manufacturer:: Texas Instruments

Category:: Data Acquisition - Analog to Digital Converters (ADC)

Package:: 144-FBGA, FCBGA

Datasheet:: ADC08DJ3200AAV.pdf

Description:: IC ADC 8BIT FOLD INTERP 144FCBGA

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Application Scenarios

What Applications Is ADC08DJ3200AAV Suitable For?

ADC08DJ3200AAV is a Data Acquisition - Analog to Digital Converters (ADC) product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Data Acquisition - Analog to Digital Converters (ADC) components. Engineers can review the ADC08DJ3200AAV datasheet, package 144-FBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate ADC08DJ3200AAV specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the ADC08DJ3200AAV description, package 144-FBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports ADC08DJ3200AAV datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for ADC08DJ3200AAV Pricing & Technical Support

Product Overview

ADC08DJ3200AAV is a Data Acquisition - Analog to Digital Converters (ADC) product from Texas Instruments. It is supplied in package 144-FBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide ADC08DJ3200AAV datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC ADC 8BIT FOLD INTERP 144FCBGA

Key Features

Part Number:ADC08DJ3200AAV
Manufacturer:Texas Instruments
Category:Data Acquisition - Analog to Digital Converters (ADC)
Package:144-FBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

ADC08DJ3200AAV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for ADC08DJ3200AAV stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tray,Tray
Series:

-
Product Status:

Active
Number of Bits:

8
Sampling Rate(PerSecond):

3.2G, 6.4G
Number of Inputs:

1, 2
Input Type:

Differential, Single Ended
Data Interface:

JESD204B, Serial
Configuration:

MUX-ADC
Ratio-S/H:ADC:

-
Number of A/D Converters:

2
Architecture:

Folding Interpolating
Reference Type:

Internal
Voltage-Supply Analog:

1.05V ~ 1.15V, 1.8V ~ 2V
Voltage-Supply Digital:

1.05V ~ 1.15V
Features:

Temperature Sensor
Operating Temperature:

-40°C ~ 85°C
Category:

Data Acquisition - Analog to Digital Converters (ADC)
Datasheet:

ADC08DJ3200AAV.pdf

ADC08DJ3200AAV Frequently Asked Questions

Is ADC08DJ3200AAV currently in stock? ▼

FudongIC currently shows 2,754 units of ADC08DJ3200AAV in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for ADC08DJ3200AAV? ▼

The minimum order quantity currently shown for ADC08DJ3200AAV is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is ADC08DJ3200AAV original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for ADC08DJ3200AAV, please note this in your RFQ.

Can you provide a datasheet or technical support for ADC08DJ3200AAV? ▼

Yes. You can view or download the ADC08DJ3200AAV.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for ADC08DJ3200AAV, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for ADC08DJ3200AAV? ▼

Yes. Based on your application, preferred manufacturer, package 144-FBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for ADC08DJ3200AAV. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use ADC08DJ3200AAV? ▼

As a Data Acquisition - Analog to Digital Converters (ADC) product from Texas Instruments, ADC08DJ3200AAV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.